Medias
Characterization of Integrated Circuit Packaging Materials
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Spécifications techniques
Date de sortie | 22 avril 2015 |
Langue | Anglais |
Éditeur | Newnes |
Accessibilité | Aucune information disponible concernant l'accessibilité pour le format PDF |